This project is pursuing two areas of interest in research. The first area deals with the thermal modeling of the next generation packaging. SLIM is a 300 micron thick film on the ceramic substrate. FLIP chips are connected to the SLIM by the means of solder bumps. Three phases of this project start with a very low heat flux (10 W/cm2) and is expected to reach fluxes as high as 100 W/cm2. Although air cooling or natural convection liquid cooling are able to meet the requirements of the first two phases, the third phase needs very aggressive liquid cooling. The initial approach modeled the problem in two dimensions. After good results were obtained, three-dimensional models were constructed to obtain solutions with better accuracy and to render the SLIM geometry more accurately. Calculations have already been run on the IBM SP and they have provided favorable results. It is planned that the finer details of SLIM have to be incorporated into the existing models for more accurate results.
Mehmet Arik, Graduate Student Researcher
Saifallah Benjaafar, Faculty Collaborator
Jivtesh Garg, Research Associate
Karl Geisler, Graduate Student Researcher
Madhusudan Iyengar, Graduate Student Researcher
William Krueger, Graduate Student Researcher
Sridhar Narasimhan, Graduate Student Researcher
Gary L. Solbrekken, Research Associate
The second project deals with one of the methods used for cooling high heat flux electronic chips (dissipation≈50-100 W/cm2), slated for use in the next generation computers. This work involves a phase change of a dielectric coolant liquid on the chip surface. This efficient mechanism is often limited by the pool boiling heat flux, which is strongly affected by the chip thermal and properties and thickness. Numerical modeling of the transient conduction process in the chip and the substrate is expected to yield a better understanding of the physics behind these effects. The Laboratory for the Thermal Management of Electronic Systems at the University of Minnesota intends to pursue ground-breaking numerical studies in the area of modeling vapor bubbles and their motion and hopes to apply subsequent findings to the current experimental research.
|
|
URL: http://www.msi.umn.edu/about/publications/annualreport/ar2000/depts/IT/MechEng/bar-cohen.html |
|
| This page last modified on Friday, 30-May-2008 16:14:05 CDT | ||
| Please direct questions or problems to help@msi.umn.edu | ||
|
Website related questions or problems should be directed to
webmaster@msi.umn.edu
The Supercomputing Institute does not collect personal information on visitors to our website. For the University of Minnesota policy, see www.privacy.umn.edu. © 2001 by the Regents of the University of Minnesota |
||