Thermal modeling and simulation of microprocessor signal interconnects

Abstract: 

Thermal Modeling and Simulation of Microprocessor Signal Interconnects

Joule heating of interconnects in IC circuits is receiving increased attention due to scaling. A local temperature increment would induce variation and reliability concerns. These researchers use ANSYS software to simulate the impact of Joule heating on the local temperature profile and to study the impact of the Joule heating induced temperature shift on the surrounding circuits. The researchers are studying the geometry and frequency dependence using MSI resources.

Group name: 
kimch